Printed wiring board
A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 μm to 100 μm between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through...
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Main Author | |
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Format | Patent |
Language | English |
Published |
17.09.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 μm to 100 μm between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate. |
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Bibliography: | Application Number: US201815935297 |