Working surface cleaning system and method

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The deb...

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Bibliographic Details
Main Authors Broz, Jerry, Duvall, James H, Humphrey, Alan
Format Patent
LanguageEnglish
Published 10.09.2019
Subjects
CLEANING
CLEANING IN GENERAL
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PERFORMING OPERATIONS
PHYSICS
PREVENTION OF FOULING IN GENERAL
TESTING
TRANSPORTING
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Summary:A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
Bibliography:Application Number: US201916290789