Semiconductor device and semiconductor package including the same

A semiconductor device includes a substrate having a cell region and a circuit region, an upper wiring layer on the substrate, and a redistribution wiring layer on the upper wiring layer. The upper wiring layer includes a secondary uppermost wiring in the circuit region and an uppermost wiring on th...

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Bibliographic Details
Main Authors Choi, Jung-Hwan, Cho, Young-Chul, Ahn, Min-Su
Format Patent
LanguageEnglish
Published 03.09.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a substrate having a cell region and a circuit region, an upper wiring layer on the substrate, and a redistribution wiring layer on the upper wiring layer. The upper wiring layer includes a secondary uppermost wiring in the circuit region and an uppermost wiring on the secondary uppermost wiring. The uppermost wiring includes an uppermost chip pad electrically connected to the secondary uppermost wiring. At least a portion of the uppermost chip pad in the cell region. The redistribution wiring layer includes a redistribution wiring electrically connected to the uppermost chip pad. At least a portion of the redistribution wiring serving as a landing pad connected to an external connector.
Bibliography:Application Number: US201715679662