Flexible packaging architecture

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the w...

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Bibliographic Details
Main Authors Mar, Kheng Tat, Cheah, Bok Eng, Kong, Jackson Chung Peng, Abd Razak, Ridza Effendi, Ooi, Kooi Chi, Periaman, Shanggar, Skinner, Michael, Chew, Yen Hsiang
Format Patent
LanguageEnglish
Published 27.08.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
Bibliography:Application Number: US201415505901