Semiconductor chip and method for producing a semiconductor chip
A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
20.08.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100). |
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Bibliography: | Application Number: US201715594519 |