Semiconductor chip and method for producing a semiconductor chip

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

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Bibliographic Details
Main Authors Stojetz, Bernhard, Eichler, Christoph, Loeffler, Andreas, Lell, Alfred, Somers, Andre
Format Patent
LanguageEnglish
Published 20.08.2019
Subjects
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Summary:A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
Bibliography:Application Number: US201715594519