Electronic part mounting heat-dissipating substrate

An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top sur...

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Bibliographic Details
Main Authors Suzuki, Ryoichi, Sekine, Takaaki, Shimakawa, Shigeru, Kogure, Teruyoshi, Sunaga, Takashi
Format Patent
LanguageEnglish
Published 20.08.2019
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
DYNAMO-ELECTRIC MACHINES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
MOTOR VEHICLES
PERFORMING OPERATIONS
PHYSICS
PRINTED CIRCUITS
RESISTORS
SEMICONDUCTOR DEVICES
TESTING
TRAILERS
TRANSPORTING
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Summary:An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
Bibliography:Application Number: US201515516730