Semiconductor package device and method of manufacturing the same

A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the fir...

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Bibliographic Details
Main Authors Fang, Yu-An, Tseng, Chi Sheng
Format Patent
LanguageEnglish
Published 06.08.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.
Bibliography:Application Number: US201715795203