Light emitting element bonded board and method of manufacturing light emitting element bonded board

A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical...

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Bibliographic Details
Main Authors Hiroshima, Yoshiyuki, Matsui, Akiko, Mukoyama, Takahide, Yamada, Tetsuro, Choraku, Kohei, Sugane, Mitsuhiko
Format Patent
LanguageEnglish
Published 16.07.2019
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical axis of the light emitting element coincides with a center line of the optical waveguide, and a bonding portion of the light emitting element is bonded to the conductive portion.
Bibliography:Application Number: US201715813191