Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate
There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent b...
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Format | Patent |
Language | English |
Published |
02.07.2019
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Subjects | |
Online Access | Get full text |
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Abstract | There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate. |
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AbstractList | There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate. |
Author | Kayano, Rinzo Kurimoto, Kouhei Kakio, Shoji Mizuno, Jun Kishida, Kazuhito |
Author_xml | – fullname: Kayano, Rinzo – fullname: Mizuno, Jun – fullname: Kurimoto, Kouhei – fullname: Kishida, Kazuhito – fullname: Kakio, Shoji |
BookMark | eNqNjbsKwkAURLfQwtc_XHuFxFikjij2ah1udicaSO6G7G4s_Hm3sBIEqxmYM5y5mogVzNSrsGJgyIXK-YE9NrEONWsQaxucbzQ9eQShRQfxv2aDsdHxzGKog39YQ7amjiVE2IehkTtVX6qlmtbcOqw-uVDr0_F6OG_R2xKujxaBL2-XNMn2SZ6nxS77h3kDJQFJYQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US10340881B2 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US10340881B23 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 30 05:41:54 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US10340881B23 |
Notes | Application Number: US201715423979 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190702&DB=EPODOC&CC=US&NR=10340881B2 |
ParticipantIDs | epo_espacenet_US10340881B2 |
PublicationCentury | 2000 |
PublicationDate | 20190702 |
PublicationDateYYYYMMDD | 2019-07-02 |
PublicationDate_xml | – month: 07 year: 2019 text: 20190702 day: 02 |
PublicationDecade | 2010 |
PublicationYear | 2019 |
RelatedCompanies | Kurimoto Kouhei WASEDA UNIVERSITY THE JAPAN STEEL WORKS, LTD Kayano Rinzo Kishida Kazuhito UNIVERSITY OF YAMANASHI Kakio Shoji |
RelatedCompanies_xml | – name: WASEDA UNIVERSITY – name: UNIVERSITY OF YAMANASHI – name: Kayano Rinzo – name: THE JAPAN STEEL WORKS, LTD – name: Kishida Kazuhito – name: Kakio Shoji – name: Kurimoto Kouhei |
Score | 3.2078087 |
Snippet | There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS |
Title | Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190702&DB=EPODOC&locale=&CC=US&NR=10340881B2 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dSwJBEB_EonorK8o-2CDuyaPz7ly9Bwm8DyRIJb3wTW7dXSjoTvTMh_75ZtczI7C3ZRf2Y5bfzH78ZgbgXogWa3geN6lUr1WUcZNRKk2LMlsy15kKpgmyPdqN3adxY1yC940vjI4TutLBERFRU8R7rvX1bPuIFWhu5eKBvWFV9hiN2oFR3I7RujUt2wg67XDQD_q-4fvteGj0XvCs67gIqHoH1fUeHqObiv4VvnaUV8rst0mJjmF_gL2l-QmURFqBQ3-Tea0CB8_FhzcWC-wtTuFLZQAWnCwQ6jqkbA2Lc4mzJ6jVdFIusko-BRFrRviuZi6UcqiRJOVknT-aZJJ8JOlSOTlor0XC_gx1BndROPK7Jq5i8iOySTzcLtg5h3KapeICiJXYglsO4xL3gdZbiedKiQa9bgnOJKeXUN3dT_W_xis4UuLXRFb7Gsr5fClu0Fzn7FbL-Rthz53o |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbokbxqyZmTyyObVT2QEy2QVD5ioDhjay0TTRxEBjy4D_vtQwxJvh2aZN-XPO7u7b3AXArRIWVPY-bVKrXKsq4ySiVpkWZLZnrjAXTDrJt2hi4T8PyMAPv61gYnSd0qZMjIqLGiPdEy-vp5hEr1L6V8zv2hk2Th3q_Ghrp7Ri1271lG6FfrXU7YScwgqA66BntF7R1HRcBVfJRXO-giV1RefZrr76KSpn-Vin1A9jt4mhxcggZEechF6wrr-Vhr5V-eCOZYm9-BF-qArDgZI5Q1ylli0jOJK6eoFTTRbnIMvoURKw8wrd1c6GEQ5FEMSer-tFkIslHFC9UkIOOWiTsz1THcFOv9YOGibsY_bBsNOhtNuycQDaexOIUiBXZglsO4xLPgZYqkedKiQq9ZAnOJKdnUNg-TuG_zmvINfqt5qj52H4-h311FNqp1b6AbDJbiEtU3Qm70jz_BvKioNg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Bonded+substrate%2C+surface+acoustic+wave+element%2C+surface+acoustic+wave+device%2C+and+method+of+manufacturing+bonded+substrate&rft.inventor=Kayano%2C+Rinzo&rft.inventor=Mizuno%2C+Jun&rft.inventor=Kurimoto%2C+Kouhei&rft.inventor=Kishida%2C+Kazuhito&rft.inventor=Kakio%2C+Shoji&rft.date=2019-07-02&rft.externalDBID=B2&rft.externalDocID=US10340881B2 |