Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate

There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent b...

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Bibliographic Details
Main Authors Kayano, Rinzo, Mizuno, Jun, Kurimoto, Kouhei, Kishida, Kazuhito, Kakio, Shoji
Format Patent
LanguageEnglish
Published 02.07.2019
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate.
Bibliography:Application Number: US201715423979