Semiconductor wafer and method for processing a semiconductor wafer
According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one tetrahedral amorphous carbon layer formed at least one of over or in the integrated circuit structure, the at least one tetrahedral amorphous carbon l...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
18.06.2019
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Subjects | |
Online Access | Get full text |
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Summary: | According to various embodiments, a semiconductor wafer may include: a semiconductor body including an integrated circuit structure; and at least one tetrahedral amorphous carbon layer formed at least one of over or in the integrated circuit structure, the at least one tetrahedral amorphous carbon layer may include a substance amount fraction of sp3-hybridized carbon of larger than approximately 0.4 and a substance amount fraction of hydrogen smaller than approximately 0.1. |
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Bibliography: | Application Number: US201815969868 |