Bonding apparatus and method

A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is...

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Main Authors Chiu, Chih-Yuan, Wu, Pei-Shan, Hu, Yi-Ting, Chen, Wen-Ming, Lee, Ming-Tan, Wang, Yu-Lin, Chen, Wei-Chih, Shin, Pin-Yi, Chang, Yuh-Sen
Format Patent
LanguageEnglish
Published 04.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.
Bibliography:Application Number: US201414157271