Mechanically stable cobalt contacts
A cobalt contact includes a dual silicide barrier layer. The barrier layer, which may be formed in situ, includes silicides of titanium and cobalt, and provides an effective adhesion layer between the cobalt contact and a conductive device region such as the source/drain junction of a semiconductor...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
28.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A cobalt contact includes a dual silicide barrier layer. The barrier layer, which may be formed in situ, includes silicides of titanium and cobalt, and provides an effective adhesion layer between the cobalt contact and a conductive device region such as the source/drain junction of a semiconductor device, eliminating void formation during a metal anneal. |
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Bibliography: | Application Number: US201715630002 |