Levelers for copper deposition in microelectronics

A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.

Saved in:
Bibliographic Details
Main Authors Rouya, Eric, Whitten, Kyle, Paneccasio, Jr., Vincent, Richardson, Thomas
Format Patent
LanguageEnglish
Published 21.05.2019
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.
Bibliography:Application Number: US201514854561