Methods of forming connector pad structures, interconnect structures, and structures thereof

Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM...

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Main Authors Cheng, Ming-Da, Chen, Wei-Yu, Chen, Hsien-Wei, Chang, Chia-Lun, Lin, Hsiu-Jen, Liu, Chung-Shi
Format Patent
LanguageEnglish
Published 23.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
Bibliography:Application Number: US201815936743