Semiconductor package and method of manufacturing the same

A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along...

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Bibliographic Details
Main Authors Choi, Jong Woo, Cho, Hyun Kook, Yoon, Hyuk Joo, Kwon, Hyuk Ki
Format Patent
LanguageEnglish
Published 23.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
Bibliography:Application Number: US201715634074