External-leadwire crimping apparatus

• Main Authors: Li, Yanping, Huang, Xinwei, Liu, Junjun, Ke, Yusheng, Wang, Jiali, Wang, Yun
• Format: Patent
• Language: English
• Published: 16.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.