Multilayer composite comprising an EVOH layer

A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to...

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Bibliographic Details
Main Authors Berger, Jasmin, Resing, Mario, Gahlmann, Klaus, Goering, Rainer, Boeer, Michael
Format Patent
LanguageEnglish
Published 09.04.2019
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Summary:A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a molding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide molding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.
Bibliography:Application Number: US201615072973