Laser ablation for wirebonding surface on as-cast surface

• Main Authors: Yagoda, Jared, Gradler, Dana
• Format: Patent
• Language: English
• Published: 02.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method of removing material from a surface, which includes the steps of providing a base layer, at least one layer attached to the base layer, an intermediate finish surface, and a bonding interface surface. The intermediate finish surface is formed by removing the at least one layer and a portion of the base layer during a material removal process. The bonding interface surface is formed by a polishing process applied to the intermediate finish surface. There is an oxidation layer which is part of the base layer, as well as a mold release layer and a contamination layer, both of which are part of the at least one layer. The material removal process involves laser etching the at least one layer to create the intermediate finish surface, and the polishing process includes applying a second laser etching to the intermediate finish surface, forming the bonding interface surface.