Sensor chip stack and method of producing a sensor chip stack
The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being ar...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English |
| Published |
26.03.2019
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material. |
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| AbstractList | The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material. |
| Author | Schrank, Franz Kraft, Jochen Parteder, Georg Troxler, Thomas Fitzi, Andreas |
| Author_xml | – fullname: Parteder, Georg – fullname: Fitzi, Andreas – fullname: Schrank, Franz – fullname: Troxler, Thomas – fullname: Kraft, Jochen |
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| Notes | Application Number: US201715636545 |
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| RelatedCompanies | ams International AG |
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| Snippet | The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
| Title | Sensor chip stack and method of producing a sensor chip stack |
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