Method of manufacturing semiconductor devices by using sampling plans

• Main Authors: Roeßiger, Martin, Habets, Boris, Erley, Georg, Buhl, Stefan
• Format: Patent
• Language: English
• Published: 19.03.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; HOLOGRAPHY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MATERIALS THEREFOR; MEASURING; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; REGULATING; SEMICONDUCTOR DEVICES; TESTING

A method of manufacturing semiconductor devices includes defining a sampling plan that contains position information about metrology sites on process wafers. A first property of the process wafers is measured to obtain measurement values at measurement points, wherein a quantity of the measurement points per process wafer is at least tenfold a quantity of the metrology sites. A sampling model that includes at least a wafer model is updated on the basis of the measurement values. The sampling plan is updated on the basis of an assessment of deviations of the measurement values from a current sampling model.