Method of manufacturing semiconductor devices by using sampling plans
A method of manufacturing semiconductor devices includes defining a sampling plan that contains position information about metrology sites on process wafers. A first property of the process wafers is measured to obtain measurement values at measurement points, wherein a quantity of the measurement p...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A method of manufacturing semiconductor devices includes defining a sampling plan that contains position information about metrology sites on process wafers. A first property of the process wafers is measured to obtain measurement values at measurement points, wherein a quantity of the measurement points per process wafer is at least tenfold a quantity of the metrology sites. A sampling model that includes at least a wafer model is updated on the basis of the measurement values. The sampling plan is updated on the basis of an assessment of deviations of the measurement values from a current sampling model. |
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Bibliography: | Application Number: US201615049495 |