Multiple voltage light emitter packages, systems, and related methods

Light emitter packages, systems, and methods having multiple light emitter chips and operable at multiple voltages are provided. In some aspects, light emitter packages described herein include a submount having a plurality of contact pads and a plurality of light emitting diode (LED) chips disposed...

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Bibliographic Details
Main Author Wilcox, Kurt S
Format Patent
LanguageEnglish
Published 19.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
WEAPONS
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Summary:Light emitter packages, systems, and methods having multiple light emitter chips and operable at multiple voltages are provided. In some aspects, light emitter packages described herein include a submount having a plurality of contact pads and a plurality of light emitting diode (LED) chips disposed over one or more surfaces thereof. The plurality of contact pads are configured to pass electrical current into the plurality of LED chips for allowing the package to be operable in at least two different voltages. The package can be operable at approximately 3 volts (V) or more, approximately 6V or more, approximately 9 V or more, approximately 12V or more, approximately 18 V or more, or approximately 36 V or more.
Bibliography:Application Number: US201414286344