Burst resistant thin wall heat sink

• Main Authors: Tian, Shurong, Hall, Shawn A, Coteus, Paul W, Schultz, Mark D, Takken, Todd E
• Format: Patent
• Language: English
• Published: 05.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; COMBINED OPERATIONS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MACHINE TOOLS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WEAPONS; WELDING; WORKING BY LASER BEAM

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.