Workload allocation based on downstream thermal impacts

• Main Authors: Holland, Jeffrey S, Cudak, Gary D, Ramineni, Pradeep, Alshinnawi, Shareef F
• Format: Patent
• Language: English
• Published: 19.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

An apparatus for workload management includes a thermal relationship module, a thermal effect module, and a resource allocation module. The thermal relationship module determines a plurality of thermal relationships among components of an electronic device. Each thermal relationship quantifies a thermal impact on one of the components of utilizing another of the components. The thermal effect module determines one or more potential thermal effects of a workload on the components based on the thermal relationships. The one or more potential thermal effects correspond to one or more possible allocations of resources of at least a portion of the components to run the workload. The resource allocation module selects an allocation of resources from the one or more possible allocations of resources to run the workload, based on the determined potential thermal effects.