Printhead with microelectromechanical die and application specific integrated circuit

A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and...

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Bibliographic Details
Main Authors Van Brocklin, Andrew L, Fricke, Peter James
Format Patent
LanguageEnglish
Published 29.01.2019
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.
Bibliography:Application Number: US201415518299