Multi-fiber/port hermetic capsule sealed by metallization and method

An hermetically sealed monolithic photonic integrated circuit (PIC) including optical components and multiple optical and electrical inputs/outputs. The integrated circuit including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed therein. The...

Full description

Saved in:
Bibliographic Details
Main Author Lebby, Michael
Format Patent
LanguageEnglish
Published 25.12.2018
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:An hermetically sealed monolithic photonic integrated circuit (PIC) including optical components and multiple optical and electrical inputs/outputs. The integrated circuit including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed therein. The electrical and optical components having multiple optical and electrical inputs, multiple optical and electrical outputs, and/or multiple optical and electrical inputs and outputs. A semiconductor/metal basic lid is sealed to the semiconductor/metal base by metallization so as to form a chamber including the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and the sensitive components from the ambient in a basic hermetic capsule with multiple optical pathways coupling multiple optical fibers to the optical components sealed within the chamber.
Bibliography:Application Number: US201815994966