Interconnect structure and manufacturing method thereof

An interconnect structure includes a first substrate including a first surface, a second surface opposite to the first surface, a cavity extended through the first substrate, and a first recess extended from the second surface towards the first surface; a second substrate disposed opposite to the se...

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Bibliographic Details
Main Authors Yu, Hsiu-Mei, Cheng, Chia-Jen
Format Patent
LanguageEnglish
Published 18.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An interconnect structure includes a first substrate including a first surface, a second surface opposite to the first surface, a cavity extended through the first substrate, and a first recess extended from the second surface towards the first surface; a second substrate disposed opposite to the second surface of the first substrate; an electronic device disposed within the cavity; a first polymeric layer disposed over the first surface and within the cavity of the first substrate; and a second polymeric layer disposed between the first substrate and the second substrate and within the first recess.
Bibliography:Application Number: US201715842498