Compliant heat sink

A compliant heat sink for transporting heat away from at least one electronic component, the heat sink includes a body, where the body includes a flexible element thermally contacting at least one electronic component. The heat sink further includes a cavity located in the body, where the cavity is...

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Bibliographic Details
Main Authors Meijer, Gerhard I, Schlottig, Gerd
Format Patent
LanguageEnglish
Published 18.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A compliant heat sink for transporting heat away from at least one electronic component, the heat sink includes a body, where the body includes a flexible element thermally contacting at least one electronic component. The heat sink further includes a cavity located in the body, where the cavity is at least partially covered by the flexible element. The heat sink further includes a raised member of the body coupled to the flexible element, where a portion of the raised member partially extends into the cavity. The heat sink further includes a guiding structure of the body coupled in the cavity of the body, wherein the guiding structure is adapted for guiding the movement of the raised member in a moving direction.
Bibliography:Application Number: US201715633977