Integrated circuit for a stable electrical connection and manufacturing method thereof

An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the p...

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Bibliographic Details
Main Authors Yang, Jeong Do, Song, Sang Hyeon, Jo, Jung Yun, Hwang, Jeong Ho, Kim, Byoung Yong, Ha, Seung-Hwa, Ryu, Seung-Soo
Format Patent
LanguageEnglish
Published 11.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.
Bibliography:Application Number: US201715615123