Radio frequency shielding within a semiconductor package

Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Saved in:
Bibliographic Details
Main Authors Baumgartner, Peter, Memmler, Bernd, Goetz, Edmund, Mueller, Jan-Erik
Format Patent
LanguageEnglish
Published 20.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION
Online AccessGet full text

Cover

More Information
Summary:Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
Bibliography:Application Number: US201615174545