Floating package stiffener
Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodimen...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
20.11.2018
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed. |
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Bibliography: | Application Number: US201615335999 |