Dielectric material with enhanced breakdown strength

An enhanced breakdown strength dielectric material includes a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surf...

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Bibliographic Details
Main Authors Taylor, William L, Fisher, Carl E, Lottes, Andrew C, Huynh, Paul V, Biyikli, Levent, Somasiri, Nanayakkara L. D
Format Patent
LanguageEnglish
Published 06.11.2018
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
DYES
ELECTRICITY
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS AS ADHESIVES
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Summary:An enhanced breakdown strength dielectric material includes a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.
Bibliography:Application Number: US201515519399