Bonding method
A method is provided of bonding a first component to a second component. The method includes: locating the first component against the second component to form an interface between the components, a curable adhesive being provided at the interface; locating a pressurizable, fluid-filled bladder agai...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
06.11.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A method is provided of bonding a first component to a second component. The method includes: locating the first component against the second component to form an interface between the components, a curable adhesive being provided at the interface; locating a pressurizable, fluid-filled bladder against the first component such that the first component is sandwiched between the second component and the bladder; locating a backing member against the bladder such that the bladder is sandwiched between the backing member and the first component; pressurizing the bladder such that a consolidating pressure is exerted by the bladder on the first component to conform the first component to the second component; and curing the adhesive while the first component is conformed to the second component by the consolidating pressure. |
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Bibliography: | Application Number: US201615209161 |