Cutting elements with wear resistant diamond surface

Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater t...

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Bibliographic Details
Main Authors Davis, Ryan, Fang, Yi, Horman, Scott L, Belnap, J. Daniel, Zhang, Haibo
Format Patent
LanguageEnglish
Published 16.10.2018
Subjects
EARTH DRILLING
EARTH DRILLING, e.g. DEEP DRILLING
FIXED CONSTRUCTIONS
GRINDING
MINING
OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater than about 500 MPa.
Bibliography:Application Number: US201414475311