Method of making composite polishing layer for chemical mechanical polishing pad

• Main Authors: Lugo, Diego, Qian, Bainian, Miller, Jeffrey B, Wank, Andrew, Brugarolas Brufau, Teresa, Tran, Tony Quan, Stack, Marc R, Tong, Yuhua, Veneziale, David Michael, Hendron, Jeffrey James, Jacob, George C, Kozhukh, Julia
• Format: Patent
• Language: English
• Published: 09.10.2018
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.