Directed self-assembly

The disclosure provides methods for directed self-assembly (DSA) of a block co-polymer (BCP). In one embodiment, a method includes: forming an oxide spacer along each of a first sidewall and a second sidewall of a cavity in a semiconductor substrate; forming a neutral layer between the oxide spacers...

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Bibliographic Details
Main Authors Liu, Chi-Chun, Pitera, Jed W, Cheng, Joy, Guillorn, Michael A, Tsai, Hsinyu
Format Patent
LanguageEnglish
Published 25.09.2018
Subjects
ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CINEMATOGRAPHY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FILLING PASTES
HOLOGRAPHY
INKS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORIGINALS THEREFOR
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:The disclosure provides methods for directed self-assembly (DSA) of a block co-polymer (BCP). In one embodiment, a method includes: forming an oxide spacer along each of a first sidewall and a second sidewall of a cavity in a semiconductor substrate; forming a neutral layer between the oxide spacers and along a bottom of the cavity; and removing the oxide spacers to expose the first and second sidewalls and a portion of the bottom of the cavity adjacent the first and second sidewalls.
Bibliography:Application Number: US201715728877