Metal gate structure and manufacturing method thereof

A method of manufacturing a semiconductor structure includes receiving a substrate; patterning a first active region, a second active region and an isolation between the first active region and the second active region over the substrate; disposing an inter-level dielectric (ILD) over the substrate;...

Full description

Saved in:
Bibliographic Details
Main Authors Chiang, Tsung-Yu, Chen, Kuang-Hsin, Ho, Wei-Shuo
Format Patent
LanguageEnglish
Published 21.08.2018
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method of manufacturing a semiconductor structure includes receiving a substrate; patterning a first active region, a second active region and an isolation between the first active region and the second active region over the substrate; disposing an inter-level dielectric (ILD) over the substrate; forming a first gate extended over the first active region, the isolation and the second active region; and forming a second gate over the first active region and the second active region, wherein the second gate includes a first section disposed over the first active region and a second section disposed over the second active region, a portion of the ILD is disposed between the first section and the second section.
Bibliography:Application Number: US201615358061