Cooling structure for integrated circuits and methods for forming such structure

A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined patte...

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Bibliographic Details
Main Authors Beninati, Gregory G, Wahl, Joseph M, Mayberry, Travis L
Format Patent
LanguageEnglish
Published 17.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.
Bibliography:Application Number: US201514978358