Method of manufacturing semiconductor device
A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attache...
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Main Author | |
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Format | Patent |
Language | English |
Published |
10.07.2018
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Subjects | |
Online Access | Get full text |
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