Method of manufacturing semiconductor device

A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attache...

Full description

Saved in:
Bibliographic Details
Main Author Iwaya, Akihiko
Format Patent
LanguageEnglish
Published 10.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attached to each of the first leads, the first suspension lead, and some of the second leads, and a second tape attached to each of the second leads. Further, the first tape has a lead holding part attached to each of the first leads, and a tape supporting part attached to the first suspension lead and some of the second leads and is attached to a position farther from wire connecting portion than the lead holding part.
Bibliography:Application Number: US201715791408