Decapsulation system

A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etchi...

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Bibliographic Details
Main Author Martin, Kirk Alan
Format Patent
LanguageEnglish
Published 03.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etching chamber at a low gas pressure, a f toggle mechanism mounted to a metal plate t, an etchant supply subsystem comprising sources of etchant solutions, an etchant solution pump, supply passages and controls to select etchants and etchant ratios, and a heat exchanger heating or cooling the etchant solution, etchant waste passages f conducting used etchant away. Etchants are mixed in the passages to the reaction region, and turbulence in the reaction region is promoted by impinging etchant solution on the encapsulated device.
Bibliography:Application Number: US201715661330