LIQUID HEAT EXCHANGER FOR COOLING HIGH-POWER MICROPROCESSOR

The proposed liquid heat exchanger for cooling high-power microprocessor contains a plate made of heat-conducting material, at least one rib, at least slotted cavities for liquid heat carrier, a cover, an inlet pipe connector, and the outlet pipe connector.

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Bibliographic Details
Main Authors NIKOLAIENKO TYMOFII YURIIOVYCH, TYMOSCHENKO ANDRII VOLODYMYROVYCH, MALKIN EDUARD SEMENOVYCH, NIKOLAIENKO YURII YEHOROVYCH
Format Patent
LanguageEnglish
Published 15.09.2006
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The proposed liquid heat exchanger for cooling high-power microprocessor contains a plate made of heat-conducting material, at least one rib, at least slotted cavities for liquid heat carrier, a cover, an inlet pipe connector, and the outlet pipe connector.
Bibliography:Application Number: UA20060002264U