Shielding module and electronic assembly
A shielding module is suitable for a circuit board and a plurality of electronic components installed on a component area of the circuit board. The electronic components have different heights relative to the circuit board. The shielding module includes a protective wall, a heat dissipation seat and...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
21.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A shielding module is suitable for a circuit board and a plurality of electronic components installed on a component area of the circuit board. The electronic components have different heights relative to the circuit board. The shielding module includes a protective wall, a heat dissipation seat and a thermal conductive layer. The protective wall is adapted to be mounted to the circuit board and surround the component area. The protective wall is made of metal. The heat sink is connected to the protective wall and covers the top of the element area entirely. The heat sink is made of metal. The surface of the heat sink facing the component area has a plurality of contact areas. The contact areas respectively correspond to the electronic components. The thermal conductive layer is disposed on the contact areas, so that the contact areas contact the electronic components through the thermal conductive layer. In addition, an electronic assembly is also provided, which includes the above-mentioned circuit board, e |
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Bibliography: | Application Number: TW202312210305U |