A printed circuit board and package
A printed circuit board (PCB) of semiconductor package is disclosed which mainly includes a terminal and a solder mask, the surface of said PCB comprised of both the surface of said terminal and the surface of solder mask, By means of the planar surface of the solder mask, the better conjunction, an...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
21.08.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A printed circuit board (PCB) of semiconductor package is disclosed which mainly includes a terminal and a solder mask, the surface of said PCB comprised of both the surface of said terminal and the surface of solder mask, By means of the planar surface of the solder mask, the better conjunction, and lower cost, compared with the conventional PCB, moreover, if said PCB needs to be coupled with a carrier for enhancing the rigidity of PCB, the structure of said carrier can be adjusted to comply with the demand of enhancing the PCB, then the cost of said PCB enables to be saved. |
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Bibliography: | Application Number: TW20209205123U |