Cooling chip module

A cooling chip module includes a first fin group, a first fan, a second fin group, a second fan and a plurality of cooling elements. The first fin group has a first bottom plate and a plurality of first fins. The first fins are arranged upright and connected with the first bottom plate. The first fi...

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Bibliographic Details
Main Authors WANG, CHING-SHUN, CAI, JIN-HONG, CHEN, LEE-LUNG
Format Patent
LanguageChinese
English
Published 11.06.2016
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:A cooling chip module includes a first fin group, a first fan, a second fin group, a second fan and a plurality of cooling elements. The first fin group has a first bottom plate and a plurality of first fins. The first fins are arranged upright and connected with the first bottom plate. The first fins are formed a first concave portion. The first fan is disposed in the first concave portion. The second fin group has a second bottom plate and a plurality of second fins. The second fins are arranged upright and connected with the second bottom plate. The second fins are formed a second concave portion. The second bottom plate is disposed opposite to the first bottom plate. The second fan is disposed in the second concave portion. The cooling elements are disposed between the first bottom plate and the second bottom plate.
Bibliography:Application Number: TW20150219496U