Light emitting diode package structure

A light emitting diode (LED) package structure includes a carrier substrate, a LED and an electrostatic protection device. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface...

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Bibliographic Details
Main Authors LIN, YU-FENG, LEE, HAOUNG, TSAI, MENG-TING
Format Patent
LanguageChinese
English
Published 11.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light emitting diode (LED) package structure includes a carrier substrate, a LED and an electrostatic protection device. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes. The reflective member has a cavity and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes. The LED is disposed inside the cavity and electrically connected between the leadframes. The electrostatic protection device is disposed inside the cavity and electrically connected between the leadframes. The LED is connected in anti-parallel to the electrostatic protection device.
Bibliography:Application Number: TW20143207443U