Thin-type heat dissipator and device structure using the same

Disclosure herein is related to a thin-type heat dissipator, and device structure using this heat dissipator. In accordance with one embodiment, the heat dissipator includes a substrate composed of materials with high thermal conductivity, and a thermal diffusion-and-radiation layer. The thermal dif...

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Bibliographic Details
Main Author CAI, CHENG-EN
Format Patent
LanguageChinese
English
Published 01.05.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosure herein is related to a thin-type heat dissipator, and device structure using this heat dissipator. In accordance with one embodiment, the heat dissipator includes a substrate composed of materials with high thermal conductivity, and a thermal diffusion-and-radiation layer. The thermal diffusion-and-radiation layer is adhered to the surface of substrate. This layer is a mixture including radiation articles and glue capable of thermal diffusion. The thin-type heat dissipator is formed when the mixture is coated on the substrate. The device structure using the thin-type heat dissipator includes the inter-locked first member and second member. The heat sources to be heat-dissipated are the electronic components in the device. The thin-type heat dissipator is installed between the first and second member, and contacted with surface of the electronic component.
Bibliography:Application Number: TW20120217603U