TWI848498B

A chip packaging structure with a flip chip die includes a fiberglass substrate composed of FR-4 grade glass fiber; at least two substrate pads that are metal stacked structures with a certain thicknesses formed by stacking upward a nickel (Ni) layer, a palladium (Pd) layer and a gold (Au) layer on...

Full description

Saved in:
Bibliographic Details
Main Authors LIN, GONG-YI, HE, RUI-TENG
Format Patent
LanguageChinese
Published 11.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A chip packaging structure with a flip chip die includes a fiberglass substrate composed of FR-4 grade glass fiber; at least two substrate pads that are metal stacked structures with a certain thicknesses formed by stacking upward a nickel (Ni) layer, a palladium (Pd) layer and a gold (Au) layer on at least one first circuit layer one by one, or metal stacked structures with a certain thicknesses formed by stacking sequentially upward a nickel (Ni) layer and a gold (Au) layer on at least one first circuit layer; a fiberglass insulation layer composed of FR-4 grade glass fiber; and at least one flip chip die, in which the fiberglass substrate and each of the substrate pads have sufficient bearing capacity to carry the at least one flip chip die and that is beneficial to saving manufacturing costs.
Bibliography:Application Number: TW202211150901